Compact filter



  • From the extended  filter depth of 440mm  results a big rise of filter surface. This gives low pressure drop and long life time. The filter medium is a fibre glass/synthetik paper combination. To reach a big surface the medium is narrow pleated with a spezial distance holder technology. The pleat-packages named „filtex®RIPAC“ are fixed in a tight  V-shape casing made of plastic material. The filter is complet free of metal. The pleat-packages named „filtex®RIPAC T.“ is temperature resistant up to 120°C.  

    Application range:

    Especially for applications wich demands low pressure drop - long life time. As a high gradOr for plants with extreme high air volume rates.

    In all kinds of air conditioners or exhaust air devices. . Also for high temperatures - special execution. The filter can be fixed in the same frames like pocket filters (frame thickness is the same 25mm). The alternative to high grade pocket filters provides high energy efficiency and improved filtration efficiency at the same time. Recommended as a pre filter in applications where a final HEPA filter follows. (Clean rooms)


    The execution for high temperature resistance can be used for temperatures up to 120°C.
    For applications with very high flow rates choose execution "high flow" type FKK. For standard applications execution "flow" type FKKB.

    Types - Filter classes - Medium:

    FKXB ..."flow" class M5-H13 filtex®RIPAC
    FKX ..."high flow" class M5-H13 filtex®RIPAC
    FKX ..."high flow" high temperature resistant class M5-H13 filtex®RIPAC T.

    ☼ Energy Saver 


    • Filter medium filtex® RIPAC Narrow Pleat package
    • Filter medium filtex® RIPAC T. Narrow Pleat package high temperature resistant
    • Executions flow und high flow
    • Approximately 75% higher air volume rates than standard compact filters (higher filter efficiency)
    • High energy efficiency... "energy saver"
    • Casing in plastic material
    • All standard dimensions, special dimensions on request
    • Technical data see TECHDOC or on request